Picosun ALD-organic-bilayer encapsulation of implants prevents corrosive ion diffusion

Published: August 10, 2020

Picosun Group, Finland, reports excellent results in ALD-organic bilayer encapsulation of metal electrodes for neuroprosthetics and bioelectronic medicine.

News, Magazine & Media / Industry News

Lindberg MPH mesh-belt conveyor furnace designed for microelectronics processing

Published: August 04, 2020

Lindberg MPH, Riverside, Mich., has shipped an electric mesh-belt conveyor furnace with a nitrogen/hydrogen blend atmosphere to a microelectronics manufacturer in the United States.

News, Magazine & Media / Industry News

Advantest IC memory tester integrates burn-in, core testing for 5G product development

Published: July 19, 2020

Advantest Corp., Tokyo, has added to its H5600 family of memory testers by introducing the new, highly versatile H5620ES engineering test system, designed for both high-speed burn-in and core testing of today's DDR4, next-generation DDR5, and low-power, double-data-rate (LPDDR) devices in laboratory environments.

News, Magazine & Media / Industry News

Fischione designs techniques to prepare specimens of semiconductor solder joints

Published: July 19, 2020

Engineers from Fischione Instruments, Export, Pa., described and compared different sample preparation techniques for solder joints in a presentation from the ASM International ISTFA 2019 conference in Portland, Oregon.

News, Magazine & Media / Industry News

Time-of-flight secondary ion mass spectroscopy helps to detect counterfeit parts

Published: July 19, 2020

Engineers from MuAnalysis, Ion-Tof USA, and Tascon GmbH demonstrated how time-of-flight secondary ion mass spectroscopy provides unique information to identify suspected counterfeit semiconductor devices in a presentation from the ASM International ISTFA 2019 conference in Portland, Oregon.

News, Magazine & Media / Industry News

ON semiconductor infrared microscopy techniques minimize secondary cracks

Published: July 19, 2020

Engineers from ON Semiconductor, Japan, reported at the ASM International ISTFA 2019 conference in Portland, Oregon, that two of the most challenging tasks in analyzing fractures are a die that has not been fully cracked apart and a cracked die with electrical overstress damage.

News, Magazine & Media / Industry News

Jeol’s JSM-IT800 ultrahigh-resolution field emission SEM is being demonstrated online

Published: July 19, 2020

Jeol USA, Peabody, Mass., announces that the launch of its new field emission scanning electron microscope during the summer of 2020 includes virtual demonstrations of its powerful performance directly to those in the market for an analytical ultrahigh resolution SEM.

News, Magazine & Media / Industry News

Rigaku Onyx metrology tool measures semiconductor ultrathin films, multilayer stacks

Published: July 19, 2020

Rigaku, Japan, reports that its Onyx 3000 instrument combines advanced X-ray and optical techniques, offering unique metrology approaches in many areas, leading to in-line solutions for these processes.

News, Magazine & Media / Industry News

Worldwide semiconductor sales increase 1.5 percent month-to-month in May

Published: July 18, 2020

The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors were $35.0 billion in May 2020, an increase of 5.8 percent from the May 2019 total of $33.0 billion and 1.5 percent more than the April 2020 total of $34.4 billion.

News, Magazine & Media / Industry News

Imec and Global Foundries demonstrate chip optimized for calculations in memory devices

Published: July 18, 2020

Imec, Belgium, and Global Foundries, Santa Clara, Calif., announce a hardware demonstration of a new artificial intelligence chip.

News, Magazine & Media / Industry News