Nanotronics patented Super Resolution imaging system identifies defects in less time

Published: May 17, 2019

Nanotronics, Brooklyn, N.Y., has expanded its Super Resolution imaging system portfolio with a new patented system that identifies and classifies defects at lower resolutions than traditional inspection microscopy, providing faster scan times and enhanced throughput.

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SkyWater selects Veeco’s Waferstorm for 3D monolithic system-on-a-chip development

Published: May 17, 2019

Veeco Instruments Inc., Plainview, N.Y., announces that SkyWater Technology Foundry has taken delivery of the WaferStorm single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology.

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U.S. semiconductor industry calls for federal policies to advance chip technology

Published: May 17, 2019

The Semiconductor Industry Association, Washington, has released a set of government policy recommendations for sustaining and strengthening America’s global leadership in semiconductor technology and ensuring that the United States wins the race to harness the transformative semiconductor-enabled technologies of the future.

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Axial Suspension Plasma Sprayed Ceramic Coatings for Semiconductor Applications

Published: May 17, 2019

This ITSC 2019 presentation discusses the plasma treatment of large-scale substrates, because the size of semiconductor and flat-panel-display (FPD) production equipment for dry etching and sputtering has been increasing due to the increased size of both silicon wafers and displays.

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U.S. semiconductor industry calls for federal policies to promote advanced chip technology

Published: May 14, 2019

The Semiconductor Industry Association, Washington, has released a set of government policy recommendations for sustaining and strengthening America’s global leadership in semiconductor technology and ensuring that the United States wins the race to harness the transformative semiconductor-enabled technologies of the future.

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Saki introduces ultra-fast 2D bottom-side automated optical inspection for PCBs

Published: May 13, 2019

Saki Corp., Japan, announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection system, which automates the bottom-side inspection process, eliminates board flipping and handling, and ensures quality after the potting, dip, wave, and selective soldering processes.

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ON Semiconductor to acquire 300 mm fab from GlobalFoundries for $100 million

Published: May 13, 2019

ON Semiconductor Corp., Phoenix, and GlobalFoundries, Santa Clara, Calif., have entered into a definitive agreement for ON Semiconductor to acquire a 300 mm fab located in East Fishkill, New York.

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Leco metallographic mounting press offers simple operation, touchscreen interface

Published: May 13, 2019

Leco, Saint Joseph, Mich., introduces the MX400 mounting press, which offers dual mount capability, a slim eight-inch design, a simple steel closure, low thermal mass, and energy-efficient heating with substantially faster cooling than previous generations of mounting presses.

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Oxford Instruments NanoAnalysis division wins Queen’s award for x-ray detection system

Published: May 13, 2019

Oxford Instruments, England, announces that its NanoAnalysis division has won the Enterprise 2019 Queen’s Award for the Ultim Extreme detector system which, when used in an electron microscope, enables very low-energy x-rays to be detected in semiconductor samples.

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Thermo Scientific ColorSEM integrates elemental analysis with color imaging

Published: May 13, 2019

Thermo Scientific, Hillsboro, Ore., introduces the ColorSEM, with the first commercial solution that includes elemental analysis integrated with unique color imaging.

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