Women in Engineering Profile: Virginia Osterman

Published: November 26, 2018

This profile series introduces leading materials scientists from around the world who happen to be females. Here we speak with Virginia M. Osterman, senior scientist at Solar Atmospheres Inc. in Souderton, Pa.

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Third quarter silicon wafer shipments set new record of 3,255 million square inches

Published: November 18, 2018

The SEMI Silicon Manufacturers Group (SMG), Milpitas, Calif., reports that worldwide silicon wafer area shipments increased during the third quarter 2018, surpassing record second quarter 2018 area shipments to set another all-time high.

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Swiss Federal Labs join heat-sensitive materials with reactive foil nanolayers

Published: November 16, 2018

Researchers at Swiss Federal Laboratories (EMPA) announce that they have developed a joining process in which reactive nano-multilayers join a wide variety of heat-sensitive components without any loss in quality.

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Artemis acquires Superior Technical Ceramics for its range of advanced ceramics

Published: November 15, 2018

Superior Technical Ceramics (STC), St. Albans, Vt., has been acquired by Artemis Capital Partners for its diverse range of advanced ceramics for technical applications such as those that must function in high heat, corrosive environments, thermal management challenges, mechanical wear problems, electrical insulation requirements, and high temperature/pressure conditions.

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H.C. Starck Analytical Services to become independent company named ChemiLytics

Published: November 09, 2018

H.C. Starck Analytical Services, Germany, announces that it will become an independent company with the name ChemiLytics GmbH & Co. KG, yet will remain part of the H.C. Starck Group and will serve both internal and external customers.

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Tescan’s newest plasma FIB-SEM enables large area cross sections, high throughput rate

Published: November 09, 2018

Tescan USA, Warrendale, Pa., introduces the S9000X, its latest flagship Xe plasma FIB-SEM, which provides precise, damage-free large area cross-sectioning coupled with a high throughput rate, up to 50 times faster than conventional gallium FIBs.

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Oxford’s CMOS-based EBSD detector cuts acquisition time to two hours in Tata Steel lab

Published: November 09, 2018

Oxford Instruments, England, announces that Tata Steel, India, recently upgraded its EBSD facility at its Advanced Material Characterization Laboratory by replacing the existing Oxford Instruments Nordlys detector and Aztec HKL EBSD, with the latest CMOS sensor-based Symmetry EBSD detector system.

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Buehler and Instron exhibit latest test/analysis instruments at ISTFA 2018

Published: November 09, 2018

Buehler, Lake Bluff, Ill., and Instron, Norwood, Mass., demonstrated their latest innovations, accessories, and consumables for materials testing in the electronics industry at ISTFA 2018.

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ISTFA 2018 Conference summary and highlights

Published: November 08, 2018

Two weeks ago, ASM Events coordinated the International Symposium for Testing and Failure Analysis (ISTFA) in Phoenix, co-located with the IEEE International Test Conference (ITC).

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Presto Engineering certifies semiconductor test facility in France to ISO quality standard

Published: October 22, 2018

Presto Engineering, San Jose, Calif., reports that it has completed certification to the ISO 9001:2015 quality standard at its facility in Caen, France, which is Europe’s largest independent semiconductor test facility.

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