Carpenter to invest $100 million in soft magnetic materials and precision rolling mill

Published: April 01, 2018

Carpenter Technology Corp., Philadelphia, announces that it will invest $100 million in soft magnetic materials production and a new precision hot strip rolling mill at its facility in Reading, Pennsylvania, to help meet increasing demand for aerospace, consumer electronics, and electric vehicle manufacturing customers.

News, Magazine & Media / Industry News

Optomec develops 20-micron printed electronics system for advanced packaging

Published: March 19, 2018

Optomec, Albuquerque, N.M., has released its Aerosol Jet HD production system for electronics packaging, a compact, configurable production platform that can dispense a wide range of materials with features as small as 20 microns.

News, Magazine & Media / Industry News

Applied Materials receives Intel’s Preferred Quality Supplier award

Published: March 19, 2018

Applied Materials Inc., Santa Clara, Calif., has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award.

News, Magazine & Media / Industry News

January semiconductor sales reached $37.6 billion, up 22.7% over January 2017

Published: March 19, 2018

The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $37.6 billion for the month of January 2018, an increase of 22.7 percent compared to the January 2017 total of $30.6 billion.

News, Magazine & Media / Industry News

Nonlinear resonators in electronic circuits enable signals to transmit through defects

Published: March 19, 2018

The Advanced Science Research Center (ASRC) at the Graduate Center of the City University of New York announces that its researchers have developed a technology that provides robust protection against circuitry damage that affects signal transmission.

News, Magazine & Media / Industry News

WITec releases TrueMatch integrated Raman spectral database software

Published: March 19, 2018

WITec, Germany, manufacturer of 3D Raman imaging systems, is now offering TrueMatch, a powerful software component for accessing and creating Raman spectral databases.

News, Magazine & Media / Industry News

TDK to acquire Chirp Microsystems for its small-size low-power ultrasonic sensors

Published: March 19, 2018

TDK Corp., Japan, has reached an agreement with Chirp Microsystems Inc., Berkeley, Calif., a developer of high-performance ultrasonic sensing, in which Chirp becomes a wholly owned subsidiary of TDK.

News, Magazine & Media / Industry News

High-res 3D X-ray microscopy developed for nondestructive failure analysis of interconnects

Published: March 19, 2018

Researchers at Advanced MicroDevices, Singapore, and Zeiss, Pleasanton, Calif., have developed a failure analysis technique for chip-to-chip micro-bump interconnects based on high-resolution 3D X-ray microscopy.

News, Magazine & Media / Industry News

Imec and Cadence tape out industry’s first 3nm test chip to advance next-gen design

Published: March 19, 2018

Imec, Belgium, and Cadence Design Systems Inc., San Jose, Calif., announce that their long-standing collaboration has resulted in the industry’s first 3nm test chip tapeout.

News, Magazine & Media / Industry News

Interferometric displacement sensor directly measures AFM cantilever displacement

Published: March 19, 2018

Oxford Instruments Asylum Research, Santa Barbara, Calif., announces development of an interferometric displacement sensor (IDS) that provides a direct measure of AFM cantilever displacement.

News, Magazine & Media / Industry News