MIX microscope observation method combines darkfield with brightfield to detect flaws

Published: February 24, 2018

Olympus, Japan, has developed the MX63/MX63L microscopes, which provide MIX observation technology that produces unique observation images by combining darkfield with another observation method, such as brightfield, fluorescence, or polarization.

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Edax launches new revision of Apex software for energy dispersive spectroscopy systems

Published: February 24, 2018

Edax Inc., Mahwah, N.J., introduces the latest revision of its Apex analysis software, which was developed to ensure high-quality results that accelerate and simplify compositional analysis.

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Jeol InTouchScope SEM provides long-life emitter and resolution of 1.5nm at 30kV

Published: February 24, 2018

Jeol USA, Peabody, Mass., offers the JSM-IT500HR InTouchScope, a scanning electron microscope that is said to deliver high-resolution field emission SEM performance with the ease of operation of Jeol’s Tungsten SEMs.

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Global Foundries delivers 45nm RF SOI prototypes for advanced 5G applications

Published: February 23, 2018

Global Foundries, Santa Clara, Calif., announces that its 45nm RF SOI (45RFSOI) technology platform has been qualified and is ready for volume production.

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National Accelerator Lab develops x-ray method to detect flaws in 3D printed parts

Published: February 23, 2018

Scientists at the Department of Energy’s SLAC National Accelerator Laboratory, Stanford, Calif., are using x-ray light to observe and understand how the process of making metal parts using 3D printing can leave flaws in the finished product.

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Thermo Scientific develops automated, robust, compact UV-Vis spectrophotometers

Published: February 06, 2018

Thermo Scientific, Madison, Wis., introduces the Genesys family of automated, robust UV-Visible spectrophotometers, which are accessible, network-ready, and designed to meet expectations for advanced technology in a compact package.

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Leica 2-in-1 microscope saves time when conducting materials analysis

Published: January 24, 2018

Leica Microsystems, Wetzlar, Germany, introduces the new DM6 M LIBS microscope for materials analysis that allows users to analyze the two main characteristics of a material—microstructure and composition—in one work step.

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Worldwide semiconductor revenue grew 22.2% in 2017; Samsung becomes No. 1

Published: January 22, 2018

Gartner Inc., Stamford, Conn., reports that worldwide semiconductor revenue totaled $419.7 billion in 2017, a 22.2 percent increase from 2016, according to preliminary results.

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Zeiss GeminiSEM 450 field-emission SEM has ultrahigh resolution, advanced analytics

Published: January 22, 2018

Zeiss, Pleasanton, Calif., introduces its new field emission scanning electron microscope, the GeminiSEM 450, which combines ultrahigh resolution imaging with advanced analytics, while maintaining flexibility and ease of use.

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Olympus inverted metallurgical microscope features updated image analysis software

Published: January 22, 2018

Olympus Corp., Waltham, Mass., introduces the GX53 inverted metallurgical microscope with upgraded Olympus Stream image analysis software for improved observation and reporting capabilities.

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