Industry News
Keep up-to-date on the latest advances in the metals and materials industry with ASM Industry News.
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1282 items found
Bruker’s new XRD system combines its Turbo X-ray source with Atlas goniometer
Published: September 06, 2017
Bruker AXS, Billerica, Mass., introduces the D8 Discover Plus X-ray diffraction system, which combines the high power of its TXS-HE high-efficiency Turbo X-ray source, with the reliability and accuracy of its high-endurance Atlas goniometer.
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Fast silicon drift detector combined with EDS analysis software enables real-time imaging
Published: August 21, 2017
Oxford Instruments, Concord, Mass., introduces a real-time navigation and imaging system for the SEM that helps users interactively explore samples based on video-rate X-ray maps colored by element rather than the black and white electron image alone.
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Magnetic/electrostatic compound lens enables FIB/SEM to image sub-nanometer features
Published: August 21, 2017
Hitachi High-Technologies Corp., Tokyo, announces the development of an all-new high-performance Ethos FIB-SEM based on a newly developed magnetic/electrostatic compound lens that enables it to deliver advanced imaging performance resolving sub-nanometer features in high contrast for low-voltage SEM applications.
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Jeol InTouchScope SEM offers high sensitivity and high spatial resolution at faster speed
Published: August 21, 2017
Jeol USA, Peabody, Mass., introduces the newest addition to the Jeol InTouchScope series SEMs, the JSM-IT500HR, which features a high-brightness, long-life emitter with stable probe current.
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Coventor adds automated process analysis to semiconductor virtual fabrication platform
Published: August 21, 2017
Coventor Inc., Cary, N.C., announces the availability of SEMulator3D 6.1, the latest version of its semiconductor virtual fabrication platform.
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Micron’s new facility nearly doubles cleanroom space for memory storage R&D
Published: August 21, 2017
Micron Technology Inc., Boise, Idaho, has opened a new facility that will nearly double the cleanroom space dedicated to research and development, and will support a significant expansion of the company's overall R&D capabilities.
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Software enables SEM analysis of multi-layer structures without cross-sectioning
Published: August 12, 2017
Bruker Nano Analytics, Oak Park, Ill., introduces XMethod, the world's first software package for the analysis of composition and thickness of single or multiple layers, based on data obtained by sample excitation with the XTrace micro-focus X-ray source for scanning electron microscopes.
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Imaging instrument for electronics combines thermal camera, temperature measurement
Published: August 11, 2017
Flir Systems, Wilsonville, Ore., introduces the ETS320, a thermal imaging and temperature measurement instrument for electronic components and printed circuit boards.
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Mid-year global semiconductor sales up 21% compared to 2016
Published: August 09, 2017
The Semiconductor Industry Association (SIA), Washington, reports that worldwide sales of semiconductors reached $97.9 billion during the second quarter of 2017, an increase of 5.8% over the previous quarter and 23.7% more than the second quarter of 2016.
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Compact scanning TEM microscope offers fast changes between imaging and analysis
Published: August 09, 2017
Thermo Scientific, Hillsboro, Ore., introduces the Talos F200i compact scanning transmission electron microscope (S/TEM), which can be customized to meet specific imaging and analytical requirements.
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