Bruker SkyScan benchtop system features high-speed X-ray microtomography

Published: March 20, 2017

Bruker, Billerica, Mass., introduces the SkyScan 1275, a high-speed X-ray microtomography benchtop system specially designed for fast scanning using new advances in the technology of X-ray sources and efficient flat-panel detectors.

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Materion acquires Heraeus target materials for its semiconductor and other markets

Published: March 19, 2017

Materion Corp., Mayfield Heights, Ohio, announces that it has acquired the target materials business of the Heraeus Group to strengthen its position in precious and non-precious target materials for the semiconductor, architectural and automotive glass, photovoltaic, and display markets.

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January 2017 semiconductor sales up 14 percent over January 2016

Published: March 16, 2017

The Semiconductor Industry Association, Washington, announces that worldwide sales of semiconductors reached $30.6 billion for the month of January 2017, an increase of 13.9% compared to the January 2016 total of $26.9 billion.

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Swiss researchers develop X-ray tomography for 3-D imaging of 34-nm transistor on a chip

Published: March 16, 2017

Researchers of the Paul Scherrer Institute in Switzerland have reportedly made detailed 3-D images of a commercially available computer chip, marking the first time a nondestructive method has visualized the paths of a chip's internal 45-nm-wide wiring and its 34-nm-high transistors clearly without distortions or deformations.

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Barcelona scientists bond chips to circuit boards with ink containing silver nanoparticles

Published: March 16, 2017

A team of researchers at the University of Barcelona has reportedly demonstrated a new bonding technique for surface mounted devices in which an inkjet printer with ink that incorporates silver nanoparticles bonds the devices.

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Nikon PCB inspection system features intuitive navigation of electronic devices

Published: March 16, 2017

Nikon Metrology, Brighton, Mich., introduces the XT V 160, a highly flexible and cost-effective electronics and semiconductor inspection system designed for production facilities and failure analysis laboratories.

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Kateeva doubles space to manufacture inkjet printing equipment for OLED displays

Published: March 12, 2017

Kateeva, Newark, Calif., is expanding its headquarters by leasing an adjacent building at its Newark campus to facilitate production ramp-up of its Yieldjet inkjet printing manufacturing equipment for the global flat panel display industry.

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Sandia develops kinetic deposition of ceramic nanoparticles to build thin films

Published: March 05, 2017

Sandia National Laboratories, Albuquerque, N.M., reports that its scientists have developed an aerosol deposition process in which ceramic nanoparticles form coatings when deposited at high speed at room temperature.

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Solar Manufacturing designs vacuum furnace to process mu-metal shields

Published: March 01, 2017

Solar Manufacturing, Souderton, Pa., has completed a new Model HFL-5772-EQ vacuum furnace specially designed by Solar for processing mu-metal shields at Magnetic Shields Ltd. for electronic applications.

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NSL acquires Perkin-Elmer ICP-MS for quick, accurate trace element analysis

Published: February 23, 2017

NSL Analytical Services Inc., Cleveland, Ohio, announces the acquisition of a PerkinElmer NexION 350 ICP-MS, which enables NSL to analyze virtually any sample for trace elements with fast and accurate results.

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