Overcoming the optical resolution limit

Published: November 10, 2022

A team of researchers from the University of Kassel in Germany used microspheres placed directly on an object’s surface to extend the limits of interferometric topography measurements for optical resolution of small structures.

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Technique simultaneously locates multiple defects on microchip circuits

Published: November 10, 2022

By modifying an existing technique for identifying defects, researchers at the National Institute of Standards and Technology, Gaithersburg, Md., have developed a method that can simultaneously locate individual electrical flaws in multiple microcircuits on the same chip.

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Scientists develop new algorithm that may provide insights into battery corrosion

Published: November 10, 2022

Researchers at the U.S. Department of Energy’s Argonne National Laboratory, Lemont, Ill., developed a new technique that accelerates the solving of material structures from patterns uncovered in x-ray experiments.

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Advantest launches universal VI and power supply card for V93000 EXA scale SoC test system

Published: November 10, 2022

Leading semiconductor test equipment supplier Advantest Corp., Japan, announced the latest addition to its extended power supply card series: the DC Scale XPS128+HV, developed to lower the cost of testing for power management ICs and other high-voltage devices.

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Top U.S. MEMS semiconductor foundry, Atomica, raises $30 million in Series C financing

Published: November 10, 2022

Atomica Corp, Santa Barbara, Calif., a leader of micro-electro-mechanical systems, raised $30 million in Series C financing.

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Samco unveils plasma-enhanced ALD system for SiC and GaN power devices

Published: October 21, 2022

Samco, Japan, launched the new AD-800LP plasma enhanced atomic layer deposition system targeting gate oxide film deposition for next-generation power devices of silicon carbide and gallium nitride materials.

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Zeiss expands in Wetzlar: additional plant in Dillfeld

Published: October 21, 2022

Zeiss Semiconductor Manufacturing Technology is building a new multifunction factory in Dillfeld, Wetzlar, Germany, in addition to the existing SMT site.

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Edax introduces Velocity Ultra

Published: October 21, 2022

Edax, Pleasanton, Calif., a leader in x-ray microanalysis and electron diffraction instrumentation, launched the Velocity Ultra, a new, faster, low-noise CMOS camera to its Velocity Electron Backscatter Diffraction Camera Series, now the fastest EBSD camera in the world.

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Researchers develop thermoformable ceramics, ‘a new frontier in materials’

Published: October 21, 2022

Researchers at Northeastern University, Boston, discovered an all-ceramic material that can be compression-molded into complex parts—an industry breakthrough— that could transform the design and construction of heat-emitting electronics, including cellphones and other radio components.

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AI enters the verification stage of chip design

Published: October 21, 2022

Cadence, Santa Clara, Calif., rolled out Verisium, its latest AI-powered electronic design automation (EDA) platform which promises to ease the amount of time and resources that chipmakers put into the verification process.

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