Invensas Corp., San Jose, Calif., announces its latest xFD products solutions. The xFD technology connects multiple memory chips in a face-down shingle-stack configuration using ultra-short wirebonds. The solution significantly reduces the cost of server and datacenter operation by providing superior data access with significantly lower cooling costs and power usage.
Invensas dsplayed its latest xFD products solutions at CES Las Vegas in January, including cloud server module solutions featuring advanced Registered Dual Inline Memory Modules (R-DIMMs) in collaboration with semiconductor manufacturer Etron Technology Inc., and memory module provider ADATA Technology.
“Invensas xFD technology plays a vital role in minimizing manufacturing cost, while enhancing electrical and thermal performance versus conventional technology,” said Dr. James Sung, president of Etron Technology. “We see significant pull from semiconductor users with Invensas xFD technology.”
“We are delighted to be at CES with Etron and ADATA,” said Simon McElrea, president of Invensas Corporation. “Semiconductor packaging, or Interconnectology as we call it at Invensas, is growing to become a vital and highly valuable element of the mobile and cloud storage landscape. Our intellectual property and technology solutions continue to gain traction with key customers and supply chain partners in this exciting space.”
