Indium Corp., Utica, N.Y., has developed BiAgX high-melting-point lead-free solder paste for high-reliability electronics assembly. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
BiAgX is excellent for small, low-voltage QFN packages that for portable electronics (smartphone/tablet), automotive electronics, and industrial applications. It excels in high temperature environments in excess of 150°C. It requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process.
It addresses both customer demands and potential legislative changes that eliminate lead from high-melting die-attach applications. It is both Pb-free and Sb-free and does not contain costly specialty materials such as nanosilver or sintering aids.
BiAgX reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
