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Mask blank inspection system designed for technology nodes of 14nm through 7nm

Lasertec Corp., San Jose, Calif., introduces  MAGICS series M8350/M8351, a new line of mask blank inspection systems that meet the requirement of next-generation semiconductor photomasks at the technology nodes of 14nm through 7nm. The progress of photolithography is continuing while commercial application of EUV lithography is delayed. With photomasks being used for more advanced ICs, the quality of mask blanks must also be enhanced.  An inspection system with higher sensitivity is crucial in this respect.

Newest in MAGICS series, M8350/51 is designed to meet next-generation inspection needs with high sensitivity suitable for such applications as inspection of quartz substrates for high-end blanks, inspection at various deposition processes, and inspection of resist-coated blanks.

Drawing on the core technology of MAGICS series, M8350/51 has achieved enhanced sensitivity by featuring a new 355nm laser light source as well as by incorporating state-of-the art inspection optics and detection circuitry. With maximum sensitivity of 35nm, M8350/51 has a significantly higher defect detection capability than previous models.

M8350/51 has already attracted inquiries from potential customers, to whom Lasertec plans to deliver multiple units in 2014. Lasertec is determined to contribute to quality enhancement of next-generation high-end mask blanks as well as to improvement of incoming inspection and process management at mask shops.

http://www.lasertec.co.jp/en/topics/2014/new-product-maskblanks-inspection-system-m8350m8351.html

 

 

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