Amkor Copper, Chandler, Ariz., has available a copper pillar bump flip chip interconnect, which offers advantages in many designs while meeting current and future ROHS requirements. It is an excellent interconnect choice for applications such as transceivers, embedded processors, application processors, power management, baseband, ASICs, and SOCs, where some combination of fine pitch, ROHS/green compliance, low cost, and electromigration performance are required.
The pillars have fine pitch capable down to 50 μm in-line and 40 μm / 80 μm staggered. Cost reduction is possible in many designs by reducing substrate layer counts. It provides superior electromigration performance for high current carrying capacity applications.
Copper pillar bumps are compatible with bond pad opening / pitch and pad metallization of dies designed for wire bond, which enables quick time-to-market for conversion to flip chip. Lead free bump caps can be placed on copper pillars for green solutions. The small fillet requirement for underfill enables more aggressive die-to-package design rules and a smaller package footprint.
