Kyocera America Inc., San Diego, announces the U.S. introduction of its XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver higher performance than high-lead solders. The lead-free, pressureless paste exhibits excellent thermal and electrical performance, plus strong adhesion to bare copper, making it ideal for high-reliability applications such as power semiconductors, automotive modules, and high-brightness LEDs.
“High-power devices such as insulated-gate bipolar transistors (IGBTs), LED power sources, and automotive modules have hit a performance ceiling due to the limited thermal dissipation offered by traditional power die attach materials,” says Bob Whisler, president of Kyocera America Inc. “Kyocera’s Silver Sinter Paste is the solution that will help drive technology to the next level by enabling customers to overcome ongoing technical hurdles and maximize package performance.”
Based on nano-silver technology, the paste demonstrates thermal conductivity of more than 200 W/mK, and excellent die-shear adhesion to bare copper, and silver- and gold-plated surfaces. Compared to standard solders and electrically conductive die-attach pastes, Silver Sinter Paste offers more than three times the thermal conductivity. Moreover, through the utilization of a novel resin-dispersion system, the paste shows excellent interface reliability in the most demanding applications.
The material offers a low-temperature, pressureless silver solder option that enhances the performance of high-power semiconductor devices such as gallium nitride and silicon carbide.
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