Picosun Oy, Finland, and Carleton University, Ottawa, have collaborated to develop a process in which atomic layer deposition (ALD) technology deposits thin uniform gold films on complete silicon wafers. The gold films were prepared using the Picosun plasma ALD tool and a new gold precursor.
“We have worked on gold metal deposition chemistry for a few years now, and this process is a breakthrough. Our Picosun ALD system handles a wide variety of precursors beautifully, and its ease of use has made process development for challenging materials much easier. The uniformity that we are able to achieve is very impressive,” says Seán Barry, Associate Professor of the Department of Chemistry, Carleton University.
“We are excited about these recent advances in gold deposition by ALD. Picosun’s plasma ALD technology is optimal for metal deposition. This has enabled gold manufacturing also before, but the now published, larger scale results will definitely catch the interest of a vast number of our production customers in IC, MEMS, and electronics industries,” says Dr. Wei-Min Li, Applications Director of Picosun.
