International Symposium for Testing and Failure Analysis
November 1-5 in Portland, Ore.
ISTFA 2015 features over 22 technical sessions, 106 presentations, four user groups, and 18 tutorials on the latest research and developments in the field of electronic device failure analysis. Topics include emerging failure analysis techniques, fault isolation, sample preparation, counterfeit electronics, and more.
In addition to the technical program, there are several other special programs taking place at ISTFA this year including mainstays like the annual ISTFA video and photo contests and the return of the popular “Tools of the Trade VIP Expo Tour,” as well as a new student poster contest. There are also three Education Workshops on Saturday, October 31: Fault Isolation, Packaging Failure Analysis, and Beam-Based Defect Localization.
Jay Demarest, Chairperson of the ISTFA 2015 Organizing Committee, encourages professionals to attend ISTFA 2015: “The organizing committee has been hard at work putting together this year’s show. We have incorporated some exciting new initiatives this year, such as a student poster contest, while sticking to our core strengths on the technical symposium, tutorial groups, equipment exposition, and education courses. I am also happy to announce that Albert Yu-Min Lin, National Geographic Explorer, has agreed to be our keynote speaker this year. Lin is doing groundbreaking work – without breaking ground – by using noninvasive computer techniques to explore archaeological sites, including that of Genghis Khan. His talk is sure to be both fascinating and insightful.”
Early bird registration for ISTFA 2015 ends September 25.
