Suss MicroTec, Germany, introduces the XB8 semi-automated wafer bonding platform, which supports substrates with a wafer size of up to 200 mm. Bond force up to 100kN is available, with a temperature range up to 550°C. Different substrate shapes and wafer sizes can be processed in specifically adapted fixtures. The XB8 wafer bonder offers a broad parameter window, and is therefore suitable for carrying out all bonding processes.
A multi-bond fixture, for example, enables the maximum possible throughput increase by bonding up to eight wafers at once. Key process parameters can be adjusted in a wide range, which makes the system ideal for advanced process development. In a production environment, the high level of automation and reliability of the XB8 ensure a high level of process stability.
Typical applications include advanced packaging, MEMS, 3D integration, and LED manufacturing.
“In addition to the high precision and the repeatability of the bonding process from wafer to wafer, a uniform process result across the wafer is essential for achieving a high yield,” says Stefan Lutter, General Manager of the bonder product lines. “The independent new heaters guarantee an even temperature distribution and also ensure optimal bonding force homogeneity within the entire temperature range. The innovative mechanical and thermal structure of the XB8 wafer bonder enables optimal bonding force and temperature distribution across the wafer, resulting in a high product quality and yield.”
