Ultratech Inc., San Jose, Calif., announces that it has received an order for multiple AP300E lithography systems from a leading outsourced semiconductor assembly and test company. Ultratech’s AP300E supports a lower cost-of-ownership strategy due to significant throughput enhancements, higher reliability, and superior alignment and illumination systems. In addition, utilizing non-contact 1X projection imaging technology greatly reduces the risk of lithography-related yield losses, while also providing the unique capabilities required for processing leading-edge advanced packaging devices.
The systems will be utilized for various advanced packaging applications, including copper pillar, wafer-level packaging, and emerging technologies such as fan-out WLP and silicon interposers to support growth driven by mobile devices.
“Recently a number of companies have been investigating reduction steppers for use in advanced packaging applications,” says Ultratech’s Rezwan Lateef. “Based on that information, this customer performed a comprehensive side-by-side onsite evaluation and found that our Unity AP300E stepper demonstrated superior imaging performance and lower cost of ownership for volume production. Specifically, our system provided a larger depth-of-focus and nearly perfect vertical sidewall angles for copper pillar applications, and demonstrated superior extendibility for next-generation, fine-pitch, fan-out WLP applications.”
The AP300 family of lithography systems is built on Ultratech’s customizable Unity Platform, delivering superior overlay, resolution, and side wall profile performance, and enabling highly automated and cost-effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as Ultratech’s award winning dual-side alignment system, utilized around the world in volume production.
