Picosun Oy, Finland, brings to the printed electronics market atomic layer deposition equipment specifically designed for large-area flexible electronics encapsulation. Organic electronics has the potential to enable a whole new generation of products, but one of its main drawbacks is sensitivity to moisture and airborne impurities. Ultra‐thin ALD nanolaminates are flexible, invisible, and practically weightless. ALD films form dense and pinhole‐free encapsulation, down to the smallest nanoscale details.
In Picosun’s new large area ALD tools, especially developed for the needs of the printed electronics industries, high quality ALD films can be manufactured cost-efficiently on large plastic sheets and at temperatures low enough for sensitive organic materials.
The company has put its extensive expertise in ALD system design to work to develop completely novel technology for the vast market of printed electronics. The new, large-area batch ALD systems have been developed and optimized in collaboration with these industries. Their disruptive design enables cost‐efficient encapsulation of large sheets of organic electronic components, producing sustainable, long‐lived end products for consumers as well as industries.
