Suss MicroTec, Germany, has launched a new generation of its fully automated ACS300 Gen3 platform specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip scale packaging, fan-out wafer-level packaging, copper pillar flip-chip, and 3D packaging.
The tool addresses the needs of a highly competitive and cost-sensitive market. Efficient module stacking allows the smallest footprint for a system with eight coaters and developers on the market, saving costly cleanroom space. The three-level modular system delivers high yield and throughput by fast and precise robots, intelligent scheduling algorithms, and a highly advanced monitoring system.
The ACS300 Gen3 provides for simultaneous 200 mm and 300 mm wafer processing without the need for a mechanical changeover. In addition, the tool can be equipped to handle 330 mm and warped wafers with a warpage of up to 10 mm. The ability to process multiple wafer shapes and sizes as well as various coat and develop materials makes the platform an efficient all-in-one solution. State-of-the-art chemical-saving features address economic as well as ecological concerns, working in line with even the most rigid sustainability standards.
“The ACS300 Gen3 is our new flagship for the advanced packaging market,” says Gary Choquette, General Manager of the Coater/Developer product line. “The ACS300 Gen3 stands for high process stability, repeatability, and yield. For example, it has more sensors for logging and control than any coating system Suss MicroTec has ever produced.”
