Veeco Instruments Inc., Plainview, N.Y., and Ultratech, Inc., San Jose, Calif., have signed a definitive agreement for Veeco to acquire Ultratech, a pioneer in laser spike anneal technology used for the production of semiconductor devices. It is also a recognized leader of lithography products for advanced packaging applications and for LEDs. Ultratech also offers wafer inspection solutions leveraging its proprietary coherent gradient sensing technology, which addresses a wide variety of semiconductor applications.
“This strategic combination will establish Veeco as a leading equipment supplier in the high growth Advanced Packaging industry,” says John R. Peeler, Veeco’s Chairman and Chief Executive Officer. “Ultratech’s leadership in lithography, together with Veeco’s Precision Surface Processing solutions, form a strong technology portfolio to address the most critical advanced packaging applications. We believe our complementary end market exposure and customer relationships will create the ideal platform to accelerate growth.”
According to Arthur W. Zafiropoulo, Ultratech Chairman and Chief Executive Officer, “Both companies have a strong heritage of developing innovative and cutting-edge technologies. The combined company will create a formidable team to execute growth opportunities and deliver significant value to customers and shareholders.”
The transaction is expected to close in the second calendar quarter of 2017, subject to approval by Ultratech shareholders, regulatory approvals in the Unted States, and other customary closing conditions.
