Zeiss, Germany, announces that a new suite of 3D x-ray imaging solutions that provide submicron and nanoscale 3D images of features and defects buried within intact structures in advanced package 3D architectures has been developed by its scientists: Xradia Context microCT, Xradia 600-series Versa 3D XRM, and Xradia 800-series Versa 3D XRM.
Imaging is enabled by rotating a sample and capturing a series of 2D X-ray images from different perspectives, followed by reconstruction of 3D volumes using sophisticated mathematical models and algorithms.
Zeiss’s Xradia Context microCT offers high contrast and resolution in a large field of view, using projection-based geometric magnification. An unlimited number of virtual cross-sections of the 3D volume may be viewed from any angle – providing valuable insight of failure locations prior to physical failure analysis. The combination of submicron and nanoscale XRM solutions provides a unique FA workflow that can significantly enhance FA success rates. The instrument is fully upgradable to Xradia Versa.
Xradia 600-series Versa is the next generation of 3D XRM for nondestructive imaging of localized defects within intact advanced semiconductor packages. It excels in structural and FA applications for process development, yield improvement, and construction analysis. Based on the award-winning Versa platform with Resolution at a Distance (RaaD) capability, Xradia 600-series Versa offers unsurpassed performance for high-resolution imaging of larger samples at long working distances to determine root causes of defects and failures in packages, circuit boards and 300 mm wafers.
Xradia 800 Ultra brings 3D XRM to the nanoscale realm, producing images of buried features with nanoscale spatial resolution while preserving the volume integrity of the region of interest. Applications include process analysis, construction analysis, and defect analysis of ultra-fine-pitch flip chip and bump connections – enabling process improvement for ultra-fine-pitch package and back-end-of-line (BEOL) interconnects. Xradia 800 Ultra enables visualization of the texture and volume of solder consumed by intermetallic compounds in fine-pitch copper pillar microbumps. Defect sites are preserved during imaging, enabling targeted follow-up analysis by a variety of techniques.
