Zeiss, Germany, introduces advancements in analytics, tomography, sample preparation, and data integrity for its new Crossbeam 350 and 550 focused ion beam SEM microscopes, as well as new time-of-flight secondary ion mass spectrometry (ToF-SIMS) detection. (The image shows nanoforsterite, Mg2SiO4.) This brings new possibilities in engineering materials, energy materials, soft materials, and geosciences, covering megatrends in additive manufacturing, battery and photovoltaic research, building materials, and nanomaterials.
As part of the introduction of its new focused ion beam scanning electron microscope (FIB-SEM), the Crossbeam 350, Zeiss introduces enhanced workflows for 3D tomography to ensure class-leading 3D data volume generation. Quantified and calibrated measurement of z-slice thickness allows for near-perfect reconstruction of tomogram slices into a reconstructed volume. An update of the Atlas 5 hardware and software package improves 3D analysis (static electron backscatter diffraction (EBSD)), correlative workflows, and definition of slice thickness. This so-called “True Z technology” ensures high quality FIB-SEM tomography.
The new loading station and sample holder for transmission electron microscopy (TEM) lamella preparation brings more ease-of-use to the TEM lamella preparation workflow, and ensures a smooth transition of the sample to the TEM for further analysis.
High-speed and high-quality data acquisition are further complemented with a release of Zeiss ZEN Intellesis, a machine learning-based segmentation software. Crossbeam 3D datasets are fully compatible with this suite of image processing and segmentation software. This ensures that data integrity is maintained as data acquisition speed and quality are improved. Texture-based classification provided by this software enables previously hidden information to be extracted from samples ranging from fiber composites to reservoir rocks.
