Rigaku, Japan, reports that its Onyx 3000 instrument combines advanced X-ray and optical techniques, offering unique metrology approaches in many areas, leading to in-line solutions for these processes.
This hybrid metrology tool makes it practical to perform high-throughput, in-line measurements on blanket and product wafers ranging from ultrathin single-layer films, to multilayer stacks. 2D- and 3D- optical microscopy enables defect detection in and characterization of BEOL structures through image analysis (of color, height, roughness, etc.) of metal stacks, solder bumps, pillars, etc.), complemented by elemental composition and thickness measurements by XRF analysis.
The Onyx is designed with high-volume manufacturing in mind: high-throughput thickness and composition measurements by XRF, rapid 2D- and 3D- optical inspection, low-contamination wafer handling, and pattern recognition-based position control for product wafer measurements.
www.rigaku.com
