Indium Corp., Clinton, N.Y., announces a new technology platform based on its SACM (Sn-Ag-Cu-Mn) solder alloy that provides stable, microstructural improvements to the intermetallic compound layer of the solder-to-pad interface. These include a fine grain size with a thin, stable IMC layer, which translates into an 800% improvement in drop-shock performance and a 50% extension in thermal cycling.
The platform consists of Indium8.9 Series solder pastes using Indium’s patent-pending SACM solder alloy technology for board-side interconnect, and SACM solder balls (spheres) for package level interconnect.
The solder satisfies the continuing demand for cost-effective reliability requirements of portable electronic devices. SACM solder alloy offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling. Its low silver content makes this a cost-effective solution for portable electronics. Solder joint architectures that utilize both SACM solder paste and SACM solder balls can maximize reliability benefits with enhanced interfaces for both solder-to-package and solder-to-printed circuit board.
