Park Systems, Santa Clara, Calif., introduces Park NX-HDM, a fully automated automatic defect review and sub-angstrom surface roughness atomic force microscopy (AFM) system for device substrates and disk media. The NX-HDM system increases throughput by up to 1000% with a 30% higher success rate than the prior system. It can analyze, identify, and scan media for all wafer sizes up to 150mm.
The survey scan, zoom-in scan, and analysis of imaged defect types are automated with wide range of automated optical inspection (AOI) tools. In addition, True Non-Contact Mode, combined with the industry’s lowest noise floor, provides accurate and reliable measurements for the sub-angstrom surface roughness of diverse media and substrates.
The unique Park dual servo system with two symmetric, low-noise position sensors are incorporated on each axis of the XY scanner to retain a high scan orthogonality for wide scan ranges and sample sizes. The secondary sensor corrects and compensates for non-linear and non-planar positional errors caused by a single sensor.
“For researchers working with hard disk media and other flat substrates, the process of identifying nanoscale defects is time consuming with conventional tools, hindering throughput. The Automatic Defect Review (ADR) speeds up and improves the way it identifies, scans and analyzes defects in substrates and media,” comments Sang-il Park, CEO and Chairman. “Beta test runs with Park NX-HDM demonstrate a 10x increase in throughput for defect review in an automated process when compared with more traditional manual methods of defect review. Moreover, we perfected the remapping and defect identification algorithm, and the success rate of the new NX-HDM is 30% higher than its previous generation, XE-HDM.”
