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February 24, 2018Jeol USA, Peabody, Mass., offers the JSM-IT500HR InTouchScope, a scanning electron microscope that is said to deliver high-resolution field emission SEM performance with the ease of operation of Jeol’s Tungsten SEMs.
February 23, 2018Olympus, Japan, has developed the MX63 series, which provides MIX observation technology that produces unique observation images by combining darkfield with another observation method, such as brightfield, fluorescence, or polarization.
February 23, 2018Global Foundries, Santa Clara, Calif., announces that its 45nm RF SOI (45RFSOI) technology platform has been qualified and is ready for volume production.
February 22, 2018Ipsen, Cherry Valley, Ill., recently designed and built a vertical high-pressure quenching furnace, complete with twin cooling systems and a work volume of 350 cubic feet.
February 22, 2018Seco Warwick, Meadville, Pa., announces that it has implemented the cloud-based Microsoft Dynamics 365 for Finance and Operations system.
February 22, 2018Inductoheat, Madison Heights, Mich., reported in a presentation at Heat Treat 2017 that recently developed inverter technology provides instantaneous and calculated frequency control during induction heating.
February 22, 2018Solar Manufacturing Inc., Souderton, Pa., is relocating its headquarters to Sellersville, also in Pennsylvania, where it will build a facility that includes 40,000 square feet for manufacturing and 17,500 square feet for office space.
February 22, 2018Wisconsin Oven Corp., East Troy, Wis., guarantees temperature uniformity of ±10°F at 775°F and 1075°F for its electrically heated standard horizontal aluminum quench systems.
February 22, 2018ASTM International, West Conshohocken, Pa., announces F3301 - 18 Standard Specification for Thermal Post-Processing Metal Parts Made Via Powder Bed Fusion.
February 06, 2018Thermo Scientific, Madison, Wis., introduces the Genesys family of automated, robust UV-Visible spectrophotometers, which are accessible, network-ready, and designed to meet expectations for advanced technology in a compact package.