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Soitec expands collaboration with Samsung Foundry on fully depleted SOI wafer supply

February 19, 2019

Soitec, France, announces an expanded collaboration with Samsung Foundry to ensure the volume supply of fully depleted silicon-on-insulator (FD-SOI) wafers.

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Ultra Tec introduces expanded software toolkit and interactive graphics for IC processing

February 18, 2019

Ultra Tec Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station.

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STEM microscope generates two electron beams to make holographs of atomic structure

February 17, 2019

The University of Oregon, Eugene, announces that its researchers have created STEM holography, a new technique that provides improved atomic resolution of a sample's outer structure and unveils previously unseen interfaces between the sample surface and the underlying material.

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Zeiss launches 3D X-ray imaging solutions for failure analysis of semiconductors

February 17, 2019

Zeiss, Germany, announces that a new suite of 3D X-ray imaging solutions that provide submicron and nanoscale 3D images of features and defects buried within intact structures in advanced package 3D architectures has been developed by its scientists: Xradia Context microCT, Xradia 600-series Versa 3D XRM, and Xradia 800-series Versa 3D XRM.

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SRC sponsors semiconductor packaging research center at Purdue and Binghamton

February 17, 2019

Purdue University, West Lafayette, Ind., announces the formation of the Center for Heterogeneous Integration Research in Packaging, or CHIRP, a new multimillion dollar semiconductor research center that will be co-directed by Ganesh Subbarayan, professor of mechanical engineering at Purdue, and Bahgat Sammakia, vice president for research and a distinguished professor of mechanical...

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Bruker introduces Skyscan benchtop 3D X-ray microscope with three-micron voxel size

February 17, 2019

Bruker, Belgium, introduces the Skyscan 1273 benchtop 3D X-ray microscope based on micro-computed tomography technology, enabling samples with up to 500 mm length, 300 mm diameter, and a maximum weight of 20 kg to be investigated with powerful and precise positioning stages.

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Global semiconductor sales increase by 13.7% in 2017 to $468.8 billion in 2018

February 17, 2019

The Semiconductor Industry Association (SIA), Washington, representing U.S. leadership in semiconductor manufacturing, design, and research, announces that the global semiconductor industry posted sales of $468.8 billion in 2018, the industry’s highest-ever annual total and an increase of 13.7 percent compared to the 2017 total.

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ST Microelectronics to acquire majority stake in wafer manufacturer Norstel AB

February 17, 2019

ST Microelectronics, Geneva, has signed an agreement to acquire a majority stake in Swedish silicon carbide wafer manufacturer Norstel AB. After closing, ST will control the entire supply chain for a portion of its SiC devices at a time of constrained global capacity, positioning itseIf for a significant growth opportunity.

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Xerox acquires Vader Systems for its liquid-metal additive manufacturing technology

February 14, 2019

Xerox, Norwalk, Conn., announces that it has acquired metal additive manufacturing company Vader Systems, which will enable it to offer its customers access to low-cost metal additive manufacturing with a greater variety of metals.

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High-temperature nickel superalloy to improve efficiency of coal-fired power plants

February 14, 2019

The U.S. Department of Energy’s National Energy Technology Laboratory (NETL), in partnership with Energy Industries of Ohio Inc., is set to scale up the fabrication of components made from advanced nickel superalloys that will help bring advanced ultrasupercritical (AUSC) power plant technology to the level of readiness for commercial-scale demonstration.

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