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Rudolph Technologies NSX 330 Series combines defect inspection and metrology

December 17, 2017

Rudolph Technologies, Flanders, N.J., introduces the NSX 330 Series, which combines defect inspection with 2D and 3D metrology.

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Olympus MX63 microscope systems optimized for analysis of large wafers, circuit boards

December 17, 2017

Olympus Scientific Solutions Corp., Waltham, Mass., announces that the MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples.

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Invensas completes direct bond technology transfer to Teledyne DALSA

December 17, 2017

Invensas, San Jose, Calif., a wholly owned subsidiary of Xperi Corp., announces the successful technology transfer of its Direct Bond Interconnect to Teledyne DALSA, a Teledyne Technologies company.

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Hirox 3D digital microscope features zoom technologies, precision mechanisms

December 17, 2017

Hirox-USA, Hackensack, N.J., introduces the RH-2000 3D digital microscope, which features high-performance lenses with incorporated zoom technologies, built-in illumination, and precision mechanisms.

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Soitec announces substrate breakthrough for 3D image sensing devices

December 17, 2017

Soitec, France, announces the latest generation of silicon-on-insulator substrates in its Imager-SOI product line designed specifically for fabricating front-side imagers for near-infrared (NIR) applications.

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$55.9B semiconductor equipment forecast: New record with Korea at the top

December 17, 2017

SEMI, Milpitas, Calif., the global industry association representing the electronics manufacturing supply chain, has released its Year-End Forecast.

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ProPlus and MPI establish strategic partnership to integrate and optimize technologies

December 17, 2017

ProPlus Design Solutions Inc., San Jose, Calif., and MPI Corp., Taiwan, announce a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates the ProPlus Spice modeling and noise characterization solution with MPI’s advanced probing technologies.

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CVD buys 180,000 sq. ft. facility to manufacture composites and electronic materials

December 17, 2017

CVD Equipment Corp., Ronkonkoma, N.Y., a provider of chemical vapor deposition systems and materials, announces that it has completed the purchase of the company’s planned additional facility in Central Islip, New York.

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Global Foundries, Ayar Labs collaborate for ten times higher bandwidth

December 17, 2017

Global Foundries, Santa Clara, Calif., and Ayar Labs, Emeryville, Calif., a startup bringing optical input/output (I/O) to silicon chips, announce a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.

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Prof. Zhigang Fang elected to National Academy of Inventors for innovations in metals

December 15, 2017

The National Academy of Inventors, Washington, D.C., announces that Prof. Zhigang Zak Fang has been elected to the rank of NAI Fellow.

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