UltraTec Manufacturing Inc., Santa Ana, Calif., offers the ICis modular microscope, which allows for fast substrate thickness measurements of backside thinned and polished samples. It offers up to three standard modes, often required by professionals in the electronics and related industries. The system is designed to be a primary tool for the engineer or technician working at a nearby polishing station.
ICis is also invaluable for fast imaging and archiving of die samples being parallel polished / de-processed. The system accepts UltraTec’s ASAP-1 sample mounting plates and UltraPol Advance quick release sample holders.
Three Imaging Modes are available — NIR as standard, with options for UV and high res visible. The ICis’ Custom software includes imaging, image optimization, annotation, Silicon Thickness measurement, navigation and archival functions.
Key applications of ICis are in Imaging topside x-section & backside electronic polished samples. ICis is an invaluable tool for validation of polished surface quality and for assessing de-processing position.
http://www.ultratecusa.com/icis-microscope
