Element Six, a member of the De Beers Group of companies, announces a new thermal grade of diamond grown by chemical vapor deposition, DiaFilm TM130. It has thermal conductivity in excess of 1300 W/mK, and is available as both metallized and un-metallized wafers.
Similar to Element Six’s material grades in its DiaFilm range, TM130 offers full isotropic heat spreading in both planar and through-plane directions. A total of five material grades spanning five levels of performance range from 1000 W/mK to 2000 W/mK.
“CVD diamond is the most thermally conductive material at room temperature, far surpassing the thermal conductivity of copper. With this new offering, we’re continuing to build our extensive portfolio of thermal grade materials to meet the needs of those in the microelectronics and electronics packaging industry,” said Director of Element Six Technologies, Adrian Wilson.
CVD diamond is uniquely suited for advanced thermal management in applications such as advanced packaging, due to its exceptional combination of properties including high thermal conductivity, mechanical strength, electrical insulation, low weight and chemical inertness. In this role, CVD diamond enables system size reductions, improved reliability and the opportunity to design higher power systems within an existing module footprint.
With a focus on customizability, Element Six’s solid thermal products are available up to three millimeters thick and in diameters up to 140 mm that can be laser-cut to any required size. Furthermore, metallization solutions enable die bonding with low thermal barrier resistance, consistent with industry standard soldering and brazing.
