Tescan, Czechoslovakia, will present a webinar on “Failure analysis of Microelectronic Devices” Wednesday May 4 at 9 am EDT. In this webinar, recent achievements in advanced failure analysis in state-of-the-art microelectronic devices will be presented.
The presentation is divided into two parts. The first part will include FA results on integrated circuits based on state-of-the-art 14-nm node technology. The focus will be on well-controlled orthogonal and planar IC delayering using gas-assisted Xe plasma FIB etching
The second part will cover FA results on advanced packaging technologies using Xe plasma FIB. It will show how TEM lamellae are prepared with Ga and Xe plasma FIB. Particular attention will be paid to the preparation of front- and back-side artifact-free lamellae.
Cross-sections with dimensions exceeding 100 µm will be demonstrated, emphasizing the mitigation of FIB artifacts using the proprietary Rocking stage technology and special masking methods. These approaches allow for processing of even the most challenging packages.
