XwinSys, Carefree, Ariz., recently launched the Onyx, a novel in-line and nondestructive hybrid metrology system that uniquely integrates advanced XRF with 2D and 3D optical technologies. It is designed to meet the current and future metrology challenges of the semiconductor industry.
The unique hybrid configuration of the Onyx enables a solution to challenging applications through various analytical approaches and effective SW algorithms.
These include:
- Metal film stacks thickness measurements
- Feature dimensions measuring
- Detection and analysis of voids or missing layers
- XRF thickness standards verification
- Detecting specific miss-processing out of a multi-variable metrology application
- Algorithm compensation for parameter variations of a film stack
