Amkor Technology Inc., Tempe, Ariz., recently received the 3D InCites “Device of the Year” award during SEMICON West for its SWIFT semiconductor package. This package can deliver 2 µm line/space lithography with up to four layers of RDL and a very dense network of memory interface vias from bottom package to the top package at a very cost competitive price.
Amkor had introduced a new, state-of-the-art fan-out structure called Silicon Wafer Integrated Fan-out Technology (SWIFT) to bridge the gap between TSV and traditional WLFO packages
The awards were a result of industry voting for individuals, companies, and products exhibiting excellence in 3D packaging expertise and contributing to the commercialization of game-changing technologies such as fan-out wafer level packaging (FOWLP), interposer-based packages, 3D stacks and 3D System-in-Package (SiP).
Amkor’s SWIFT product was uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry.
