Interlink Electronics Inc., a world-leading trusted technology partner in the rapidly advancing world of human-machine interface (HMI) devices, sensors, and other innovative technologies, is proud to announce the official opening of its new materials science and research & development lab in Camarillo, Calif. The culmination of more than six months of buildout, the new facility will provide Interlink with the physical resources necessary to develop new products and technologies.
Previously based in Singapore, Interlink’s R&D and materials science center is being brought to the United States to facilitate greater communication and collaboration as Interlink executes upon its plans to expand its product offerings. Housed within a 10,000 sq ft complex, the new facility is outfitted with state-of-the-art material characterization, printing, prototyping, and testing equipment for advanced research into novel sensing materials, devices, and applications. It will also give Interlink a greater range of technological options when developing custom solutions in-house and reducing time to market. The opening coincides with the appointment of Gene Chen as VP of engineering and advanced materials, who will direct Interlink’s team of global engineers and scientists.
“Interlink is a company deeply rooted in innovation, having been formed in 1985 to introduce Force Sensing Resistor (FSR) technology to the world and commercialize printed electronics,” said Steven N. Bronson, chairman, president, and CEO of Interlink Electronics. “Our new facility will give us the much-needed capability to expand our product offering, develop new sensor technology, carry out privately or government funded development projects, and maintain Interlink’s leadership in the HMI industry.”
For more information: Interlink Electronics
