NVIDIA, Santa Clara, Calif., announced that TSMC, Taiwan, and Synopsys, Sunnyvale, Calif., are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.
Solidifying its presence in the North American market, TESCAN Group, Czech Republic, announced the opening of its two new premier demo labs in Warrendale, Pa., and Phoenix Ariz., marking an important step in expanding its presence across the country.
Researchers at the University of Vermont developed microchips with a feature that combines anti-counterfeit with a function that causes them to self-destruct if an attempt is made to compromise them.
A new study conducted by researchers from the University of Delaware’s Center for Composite Materials (CCM) and DuPont Specialty Products, Wilmington, Del., now provides insights about a composite material that can be used to make thin, flexible and durable circuit boards.
Researchers at Lawrence Livermore National Laboratory, Livermore, Calif., have furthered a new type of soft material that can change shape in response to light, a discovery that could advance “soft machines” for a variety of fields, from robotics to medicine.
