Integrated Service Technology Inc., Taiwan, a leading provider of electronic product verification and analysis services, launched its Global Smart Reliability Center, developed in response to the growing demand for early-stage reliability testing in AI, high-performance computing, and electric vehicle applications.
Through continued collaboration with TSMC, Ansys, Canonsburg, Pa., announced enhanced AI-assisted workflows for radio frequency design migration and photonic integrated circuits, and new certifications for its semiconductor solutions.
Sigray, Inc. of Benicia, Calif. has launched the Apex-Hybrid, a breakthrough X-ray system designed to revolutionize failure analysis in semiconductor and electronics labs with interchangeable laminography and tomography modes, delivering exceptional speed and 350nm high-resolution imaging for everything from large packages and PCBs to the smallest components.
Scientists at the University of Tennessee, Knoxville, recently discovered that Mn3Si2Te6 changes from an insulator to an electrically conductive metal when exposed to a magnetic field.
Epsilon Group, India, a leading innovator in carbon black and advanced battery materials for electric vehicles and energy storage, is partnering with Tufts University in Massachusetts to launch the Tufts Epsilon Materials Institute-a new research center made possible by an $11.5 million sponsorship and dedicated to advancing materials science and engineering for global energy and sustainability solutions.
