An international team, including researchers from Washington University in St. Louis, Massachusetts Institute of Technology, Yonsei University and Inha University in Korea, Georgia Institute of Technology, and the University of Notre Dame, has demonstrated the monolithic 3D integration of layered 2D material into novel processing hardware, addressing the challenge of increased information transfer time between functional components in advanced computer chips and paving the way for AI computing.
A research team at the University of Science and Technology of China of the Chinese Academy of Sciences developed a groundbreaking chemical method for two-dimensional metal-organic lattices.
Onsemi, Scottsdale, Ariz., opened an application test lab in Piestany, Slovakia, focused on the advancement of system solutions for battery/plug-in hybrid/electric vehicles and energy infrastructure power conversion systems.
Weebit Nano Limited, Israel, a leading developer of advanced memory technologies for the global semiconductor industry, and SkyWater Technology, Bloomington, Minn., the trusted technology realization partner, announced that Weebit’s Resistive Random-Access Memory IP module has been fully qualified in SkyWater’s 130nm CMOS process at temperatures of up to 125 degrees Celsius – the temperature specified for Grade-1 automotive applications.
Oxford Instruments, England, has brought together the best of its analytical innovations to form the Oxford Instruments Innovation Center, a state-of-the-art facility at its High Wycombe site.
