The U.S. Department of Energy’s (DOE’s) Office of Science is the nation’s largest supporter of basic research in the physical sciences, the steward of 10 DOE national laboratories, and the lead federal agency supporting fundamental research for energy production and security. The DOE is involved with inventing new materials with unique properties and advancing technologies […]
Advanced Materials & Processes, Volume 181, Issue 8, November/December 2023 (ASM International)
The November/December issue of Advanced Materials & Processes magazine has an editorial focus on Testing and Characterization.
Thermo Fisher Scientific announces new electron beam fault localization system for analyzing advanced logic semiconductors
Thermo Fisher Scientific, Hillsboro, Ore., the world leader in serving science, introduced the Thermo Scientific Meridian EX System— an electron-beam-based failure analysis solution designed to enable precise fault localization on advanced semiconductor logic technologies that helps users localize defects within complex power networks and achieve 10X improvement in spatial resolution compared to optical fault isolation solutions.
Samsung to unveil 3D AI chip packaging tech SAINT to rival TSMC
Samsung Electronics Co., South Korea, the world’s largest memory chipmaker, plans to unveil an advanced three-dimensional chip packaging technology to compete with foundry leader Taiwan Semiconductor Manufacturing Company.
United Safety launches new lithium-ion battery failure detection sensor
United Safety & Survivability Corporation, Exton, Pa., a global leader in advanced safety solutions, launched its latest innovation, a groundbreaking lithium-ion battery failure detection sensor that could help prevent electric vehicle fires before they happen and sets a new standard in safety for electric vehicles across industries.