Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.
Texas Tech University’s Edward E. Whitacre Jr. College of Engineering, Lubbock, Texas, will earn $14 million from the U.S. Department of Defense Army Research Laboratory for an Advanced Semiconductor Power Devices Program that will develop reliable, high-performance and power electronic devices with wide and ultrawide bandgap semiconductors.
Dragonfly, a brand of Comet Group, Switzerland, applied high-resolution 3D X-ray imaging to inspect 20 µm micro-bumps in HBM stacks, where sub-micron voids and cracks can critically affect performance and yield.
Gatan, Inc., Pleasanton, Calif., launched the EDAX Orbis II System, designed to support a wide range of non-destructive elemental analysis that use micro x-ray fluorescence.
A sharp uptick in reported counterfeit and nonconforming electronic components in 2024 has underscored a widening threat to component authenticity, according to the latest ERAI Annual Report.
