Sematech, Albany, N.Y., announces that its researchers have reached a significant milestone in reducing to zero the defects generated by tools from the multi-layer deposition of mask blanks for extreme ultraviolet lithography.
Wafer probe system measures device electrical functioning over wide temperature range
Cascade Microtech Inc., Beaverton, Ore., has developed the CM300 Probe System, which automates on-wafer device measurements and enhances device and process characterization and modeling by capturing the true electrical performance of devices, thus enabling hands-off productivity.
Bruker’s Vertex FTIR spectrometer covers complete mid and far infrared/THz ranges in one step
Bruker Corp., Madison, Wis., announces the world’s first FTIR spectrometer that covers the complete mid and far Infrared/THz spectral ranges in one step with no gaps.
Coater/Developer system designed for fan-out wafer-level packaging
Suss MicroTec, Germany, recently introduced a coater/developer tool especially developed to process wafers for fan-out wafer-level packaging applications.
Aerospace research partnership formed
The Ronald E. McNair Center for Aerospace Innovation and Research, at the University of South Carolina, Columbia, partnered with Fokker Aerostructures, Holland, to support and inspire their development of next-generation aircraft technology.