Scientists and engineers at Johns Hopkins Applied Physics Laboratory (APL) are pioneering a new approach to materials science that leverages artificial intelligence and robotics to dramatically speed up the design, testing, and optimization of metal components critical to national defense. This initiative, called TETRA (Transforming Evaluation and Testing via Robotics and Acceleration), reimagines the traditional […]
Researchers at the University of Arizona in Tucson have developed a laser-based microscope that snaps images at attosecond — or a billionth of a billionth of a second — speed.
The U.S. National Science Foundation has selected Purdue Engineering-led Chipshub, West Lafayettes, Ind., as its Chip Design Hub by providing a $7 million grant over five years.
Researchers at the U.S. Department of Energy’s Argonne National Laboratory, Lemont, Ill., have developed a method to coat sulfide-based solid electrolytes, finding a thin, glass-like layer could be the key to longer-lasting, cost-effective solid-state batteries.
The new inter-die gapfill tool from Lam Research Corp., Fremont, Calif., expands industry-leading portfolio of solutions for 3D integration and chiplet technologies; paves way for new, AI-accelerating architectures.
