In this video, see how Lumafield uses advanced CT scanning to examine both recalled and non-recalled Anker power banks, revealing the internal factors behind a major safety recall affecting over a million units.
World’s first hybrid chip combines electronics, photonics, and quantum power
Researchers from Boston University, UC Berkeley, and Northwestern University have developed the first chip that integrates electronic, photonic, and quantum components, fabricated using a standard 45-nanometer semiconductor process.
Texas Tech to earn $14M for advanced semiconductor power devices program
Texas Tech University’s Edward E. Whitacre Jr. College of Engineering, Lubbock, Texas, will earn $14 million from the U.S. Department of Defense Army Research Laboratory for an Advanced Semiconductor Power Devices Program that will develop reliable, high-performance and power electronic devices with wide and ultrawide bandgap semiconductors.
High-resolution 3D x-ray inspection for advanced packaging: insights from HBM micro-bump analysis
Dragonfly, a brand of Comet Group, Switzerland, applied high-resolution 3D X-ray imaging to inspect 20 µm micro-bumps in HBM stacks, where sub-micron voids and cracks can critically affect performance and yield.
Gatan launches the EDAX Orbis II Micro-XRF system
Gatan, Inc., Pleasanton, Calif., launched the EDAX Orbis II System, designed to support a wide range of non-destructive elemental analysis that use micro x-ray fluorescence.