Lasertec Corp., Japan, announces that it has launched its EZ300, a wafer edge inspection system based on a new concept that contributes to higher yields at wafer edges in the production of semiconductor chips.
Carbodeon, Finland, has been granted a U.S. patent for detonation-synthesized diamond particles (nanodiamonds) that are combined with polymers to produce wear-resistant materials with good thermal conductivity.
Because of their tungsten content, F-steels form hard tungsten carbides.
Every 4700 flight hours, every U-2 reconnaissance plane is disassembled and inspected part by part, including more than 40,000 rivets and 1800 individual parts, and then reassembled by Lockheed Martin technicians.
Engineers at Massachusetts Institute of Technology, Cambridge, designed what may be the Band-Aid of the future: a sticky, stretchy, gel-like material that can incorporate temperature sensors, LED lights, and other electronics, as well as tiny, drug-delivering reservoirs and channels.
