Goodfellow Corp., Coraopolis, Pa., reports that its microporous copper foam coated with a thin, hard layer of copper oxide provides outstanding performance as a low-profile heat sink in passive cooling environments.
FEI Co., Hillsboro, Ore., introduces the Helios G4 HX as the industry’s highest throughput, dedicated TEM lamella preparation platform, designed to meet the challenges of advanced semiconductor failure analysis labs.
Bruker AXS, Madison, Wis., introduces the D8 Gen 2, which features the latest version of the Incoatec Microfocus Source, the IµS 3.0, the first microfocus source specifically designed and optimized for X-ray diffraction.
Brewer Science, Rolla, Mo., has signed a new cooperative agreement at Missouri State University’s Jordan Valley Innovation Center (JVIC) for developing nanotechnology applications to protect the U.S. military.
Mentor Graphics Corp., Wilsonville, Ore., announces that its Veloce emulation platform, specifically the Codelink offering, now supports the debug of designs built with AndesCore processors such as N10 and N13.
