An international research team from the Skoltech Engineering Center at the Skolkovo Institute of Science and Technology in Russia has, for the first time, directly measured mechanical stresses at the contact between a diamond indenter and a complex nanostructured coating at a resolution of less than 80 nanometers.
FormFactor, Livermore, Calif., and Keystone Microtech, Taiwan, partnership expands semiconductor probe card manufacturing and test capabilities to support advanced semiconductor applications
Keysight Technologies, Santa Rosa, Calif., announced Keysight Multiphysics, a design and verification solution that addresses the physics interactions driving failure in modern electronic designs, featuring a structural analysis application covering drop, shock, and vibration that enables engineering teams to identify and fix problems earlier, before a prototype is built.
Researchers at the University of Minnesota Twin Cities have, for the first time, demonstrated that Minnesota’s abundant low-grade iron ore can be converted into semiconductor-quality pyrite, also known as iron sulfide or “fool’s gold.” The breakthrough could open the door to more cost-effective and sustainable electronic devices by transforming a widely available natural resource into […]
A research team led by Saarland University materials scientist Ralf Busch is preparing its first space-based mission aboard the International Space Station, where researchers will remotely study metallic-glass alloys using hot, levitating droplets in a microgravity environment. Conducted in partnership with the European Space Agency and the German Aerospace Center, the experiments aim to generate […]
