Rice University researchers have developed a method to keep diamond stable during high-temperature, low-pressure processing, enabling the creation of a durable bulk composite material. Their research also revealed that high-speed impacts can quickly transform diamond into graphite, providing new insight into how diamond absorbs energy and changes under extreme stress. Because diamond combines exceptional hardness […]
As technology advances beyond traditional silicon-based electronics, organic semiconductors are emerging as a key material for innovations such as wearable sensors, implantable devices and foldable screens. Toulik Maitra, a Ph.D. student in chemical engineering at the University of California, Davis, is helping advance this field through computational modeling that explores how these materials behave at […]
ASM is pleased to announce that Prof. Qing Chen, FASM, of Thermo-Calc Software and KTH Royal Institute of Technology, Stockholm, is the 2027 J. Willard Gibbs Phase Equilibria Award recipient.
The August 2026 issue of Electronic Device Failure Analysis includes: Expanding the Application Range of EBIRCH; Moisture and Microelectronic Devices; Automated End-to-End AI Solution for PEM; and Building Today’s Microelectronics Workforce.
See how extreme ultraviolet (EUV) light is generated and used for imaging in advanced chipmaking in this video from ASML.
