Orbotech Ltd., Israel, announces that SPTS Technologies Group (SPTS), U.K., an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co. (SPT), a subsidiary of Sumitomo Precision Products Co.
Nordson March, Concord, Calif., announces its new Sphere Series plasma treatment systems for wafer-level and 3D packaging applications.
Researchers at Michigan State University, East Lansing, report that by shooting an ultrafast laser pulse into a semiconductor, its properties change as if it had been chemically doped.
Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems in a semiconductor manufacturing facility.
Picosun Oy, Finland, and Carleton University, Ottawa, have collaborated to develop a process in which atomic layer deposition (ALD) technology deposits thin uniform gold films on complete silicon wafers.
