Oxford Instruments Asylum Research, Santa Barbara, Calif., announces the new MFP-3D Infinity Atomic Force Microscope, which enables images such as the silicon nitride shown.

SUSS MicroTec, Germany, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house.

Semiconductor Research Corp., Research Triangle Park, N.C., reports that a team of researchers from Purdue University, Lafayette, Ind.; SEMATECH, Albany, N.Y.; and SUNY College of Nanoscale Science and Engineering, Albany, N.Y., are working on high-performance molybdenum disulfide field-effect transistors.

Entegris Inc., Billerica, Mass., has inaugurated its new i2M Center for Advanced Materials Science in Bedford, Mass.

Engineering researchers at the University of Arkansas, Fayetteville, have designed integrated circuits on silicon–carbide wafers that can survive at temperatures greater than 660°F (350°C).