NASA’s microgravity materials science program supports materials research conducted on the International Space Station (ISS). The orbital conditions on the ISS provide an environment where gravity-driven phenomena such as buoyancy-driven fluid flows and sedimentation are nearly negligible. NASA is planning to hold a workshop on its microgravity materials science program on January 7-8 in the Washington, D.C. area.
MBI Coatings, Lancaster, S.C., announces the addition of an Impact Fusion Hi Velocity Oxygen Fuel spray system. This system features higher velocities for improved coating properties and bond strength. With Impact Fusion, the particles are practically forge-welded onto the surface and onto each other to form the coating. Higher particle velocities result in higher density coatings that are more strongly bonded to the surface.
Bruker Nano Surfaces, Billerica, Mass., has joined Sematech, Albany, N.Y., to develop new semiconductor defect characterization solutions for advanced materials development. The collaboration will generate the first detailed information database that allows Bruker’s patented PeakForce QNM mechanical force data to be correlated to nanoparticle materials.
Alcoa, Pittsburgh, and VSMPO-AVISMA Corp., Russia, have agreed to join forces to meet growing demand for high-end titanium and aluminum products for aircraft manufacturers worldwide. Once formed, the joint venture will combine Alcoa’s expertise in manufacturing value-add products with VSMPO-AVISMA’s global leadership in titanium production to manufacture high-end aerospace goods, such as landing gear and forged wing components, at Alcoa’s plant in Samara.
Carnegie Mellon University’s Center for Silicon System Implementation, Pittsburgh, has received a $2.6 million grant from the National Science Foundation to develop next-generation ultra-efficient silicon chips that could trigger a revolution in how chips are designed and operated. The three-year initiative involves eight faculty members who have expertise in a variety of areas that include circuit design, computer architecture, and integrated circuit chip manufacturing.
