Boise State University, Idaho, announces a $25 million gift from the Micron Foundation that will have a transformational impact on its engineering materials research programs.
Micron donates $25 million to Boise State for materials research
Metallurgical High Vacuum announces ISO-9000-2008 certification
Metallurgical High Vacuum Corp., Fennville, Mich., announces that it has been awarded certification for its quality management system in conformance with the International Quality System Standard ISO-9000-2008.
Global Foundries introduces FX-14 application-specific integrated circuit
Global Foundries, Santa Clara, Calif., announces the availability of FX-14, an application-specific integrated circuit development built on the company’s next-generation 14-nm FinFET process technology.
Akhan Semiconductor opens global headquarters in Illinois
Akhan Semiconductor, Gurnee, Ill., has opened its global headquarters and production facility to develop and manufacture next-generation diamond-based semiconductors.
Suss wafer bonder supports substrates with wafer size up to 200 mm
Suss MicroTec, Germany, has launched XB8, a wafer bonder designed to support substrates with a wafer size up to 200 mm.