Olympus Scientific Solutions Americas Inc., Waltham, Mass., introduces the Epoch 650 digital ultrasonic flaw detector that combines conventional ultrasonic flaw detection capabilities with the efficiency of a highly portable, intuitive instrument.
FEI Co., Hillsboro, Ore., offers the Helios NanoLab 460F1, which combines the highest resolution scanning electron microscope (Elstar+UC SEM) and focused ion beam (Tomahawk FIB) columns on the market today with the most advanced sample manipulation capabilities.
Jeol USA, Peabody, Mass., announces that a state-of-the-art Jeol e-beam lithography system will soon be installed at the University of Waterloo Quantum NanoFab in Waterloo, Ontario.
Park Systems, Santa Clara, Calif., introduces the NX-Hivac AFM system for semiconductor failure analysis.
Kyocera America Inc., San Diego, announces the U.S. introduction of its XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver higher performance than high-lead solders.
