Flir Systems, Freeport, Pa., has launched three science-grade thermal cameras: the A6200sc NIR, A8300sc HD MWIR, and A6700sc LWIR. Designed for applications such as electronics development, these cooled cameras deliver high image quality, standardized interfaces, and Matlab integration. The image shows a photo of a cooled InSb pcb from the A6700sc.
Sandia National Laboratories, Albuquerque, N.M., and Purdue University, West Lafayette, Ind., have signed an extensive, five-year memorandum of understanding (MOU) to establish a strategic alliance that seeks to solve large national problems, sustain and engage human capital, and accelerate adoption of technology.
Semi, San Jose, Calif., reports that April 2015 marks the 50th anniversary of Moore’s Law.
Duke University, Durham, N.C., announces that its researchers have introduced probing solutions that may enable pre-bond and post-bond testing of through-silicon vias and logic dies used in manufacturing semiconductor components.
Fujitsu Laboratories, Japan, has reportedly developed the world’s first thin heat pipe designed for small electronic devices.
